Automated Handling
Enhance wafer handling efficiency with our advanced automated solutions
Explore our Automated Handling solutions, designed to streamline semiconductor manufacturing processes with cutting-edge technology. From robotic wafer transfer systems to fully integrated Equipment Front End Modules (EFEMs), our automated solutions optimize efficiency while minimizing breakage in substrate handling for 150mm to 300mm wafers.
Our automated solutions optimize efficiency and precision in substrate handling
A mainstream solution for silicon handling, with embedded alignment & OCR allowing fast throughput with an unrivaled compact design.
Specifically engineered for emerging manufacturing technologies (e.g. Advanced-Packaging, 3D-IC) that require increased flexibility and precision.
Our SMART EFEM solutions are systems designed for integration with inspection and process equipment.
COMPACT Wafer Sorter
The COMPACT is our flagship product for standard 300mm silicon wafer handling. Boasting a seamless design, this wafer sorter allows a high throughput with its robot’s embedded alignment & OCR functions while offering a matchless footprint as ~1m² (12ft²) for the smallest configuration.
Equipped with RECIF Technologies’ ACT end-effectors (Advanced Contact Technology) and direct drive robotics, the COMPACT sorter offers the safest vacuum free handling experience of the market.
Our spotless wafer handling solution has been improved and qualified in different RD&I projects of sub-5nm, down to 2nm applications as of today. By continuously refining the COMPACT wafer sorter, we ensure it delivers peak performance and stays ahead through early adoption of SEMI standards.
Provide your IC manufacturing line with the ultimate productivity solution for silicon wafer handling.
- Loading stages configuration: 2 or 4 load-ports
- Main Features & Benefits:
Vacuum free contact (RECIF’s ACT)
Optimized cleanliness
Embedded Wafer ID & alignment
Boosted performance
Peerless footprint: up to -40% impact1
Proprietary software
Smart auto-tuning
Carrier mapping 3D
Various options such as e-flip, FOUP’s purge, operator & FOUP protections, front side OCR - Standards:
SEMI300/S2/S14 compliant
ISO Class 1 mini-environment
Load-ports SEMI compliant E15.1/E57/E62
Suits all SEMI compliant FOUP/FOSB carrier
1 compared to the average market offer with equivalent load-port configuration
SMART wafer sorter
The SMART sorter has been engineered to support the ‘More than Moore’ applications and the emerging manufacturing technologies such as 3D-IC, FO-WLP, and more.
These applications, involving heterogeneous substrates with different physical and mechanical properties, require a versatile and precise handling.
Our proprietary software is at the core of our response to this challenge. Through infopads recognition and dual buffers, R.PACK safely manages wafers auto-segregation with SMART context hidden functions.
Equipped with RECIF Technologies’ ACT (Advanced Contact Technology) end-effectors and direct drive robotics, the SMART sorter offers the safest vacuum free handling experience of the market.
- Loading stages configuration: 2, 3 or 4 load-ports
- Main Features & Benefits:
Vacuum free contact (RECIF’s ACT)
Optimized cleanliness
Automatic wafer segregation
Proprietary software
Smart auto-tuning
Carrier mapping 3D
Various options such as dual handler, dual aligner/buffer, e-flip, FOUP’s purge, operator & FOUP protections, front side OCR - Standards:
SEMI300/S2/S14 compliant
ISO Class 1 mini-environment
Load-ports SEMI compliant E15.1/E57/E62
Suits all SEMI compliant FOUP/FOSB carrier
Also available for 380mm wafer on frame and 450mm ready
Specialized for handling 300mm wafers on 380mm frames, with single end-effector and frame-specific ID reading capabilities.
- Designed for: Handling 300mm wafers mounted on 380mm frames.
- Handling Capability: Single end-effector for secure handling.
- ID Readers: Barcode and RF frame ID readers.
- Environment: ISO Class 1 mini-environment.
- Standards: SEMI standards compliant (G74 for metal tape frame, G87 for plastic tape frame).
- Load Ports: Available in 2 or 3 load ports.
- Compatibility: SEMI compliant frame cassettes with 300mm kinematic couplings (SEMI G77) and upcoming frame FOUPs.
Tailored for larger wafers (450mm) and advanced packaging technologies, with dual end-effectors and aligners for enhanced flexibility.
- Designed for: Advanced packaging and emerging technologies including 3DIC and FO-WLP.
- Handling Capability: Standard silicon wafers, 3DIC (TSV, glass, stacks), and FO-WLP (mold compound, warped wafers).
- End-Effector Options: Dual end-effectors and dual aligners capability.
- ID Readers: Front side and backside wafer ID readers.
- Environment: ISO Class 1 mini-environment.
- Standards: SEMI 300 standards compliant.
- Load Ports: Available in 2 or 3 load ports.
- Compatibility: All SEMI compliant FOUP/FOSB types.
SMART EFEM
Our SMART EFEM is a fully in-house designed system that enables the automated loading and segregation of 300mm wafers. The system is ideal for inspection, metrology, process applications, and more.
We ensure you a smooth integration by providing our proprietary software tested with the leading semiconductor software developers.
Designed on the same base, the SMART EFEM is as skillful as the sorter to handle heterogeneous wafers with RECIF performance.
Equipped with our Advanced Contact Technology (ACT) end-effectors and direct drive robotics, the SMART EFEM offers the safest vacuum free handling experience of the market.
- Loading stages configuration: 2, 3 or 4 load-ports
- Main Features & Benefits:
Vacuum free contact (RECIF’s ACT)
Optimized cleanliness
Automatic wafer segregation
Fast wafer swap
Configurable chucks position
Proprietary software
Smart auto-tuning
Carrier mapping 3D
Various options such as dual handler, dual aligner/buffer, e-flip, FOUP’s purge, operator & FOUP protections, front side OCR - Standards:
SEMI300/S2/S14 compliant
ISO Class 1 mini-environment
Load-ports SEMI compliant E15.1/E57/E62
Suits all SEMI compliant FOUP/FOSB carrier
Also available for 380mm wafer on frame and 450mm ready
Specialized for 380mm frames with barcode and RF frame ID readers, compliant with specific SEMI standards for frame handling.
- Designed for: Handling 380mm wafers on frame for advanced manufacturing technologies.
- Handling Capability: Barcode and RF frame ID reader for secure handling.
- End-Effector Options: Single end-effector with backside Advanced Contact Technology.
- Environment: ISO Class 1 mini-environment.
- Standards: SEMI standards compliant (G74 for metal tape frame, G87 for plastic tape frame).
- Load Ports: Available in 2, 3, or 4 load ports.
- Compatibility: SEMI compliant frame cassettes with 300mm kinematic couplings (SEMI G77) and upcoming frame FOUPs.
Tailored for larger wafers and advanced packaging technologies with dual end effectors and aligners for enhanced flexibility.
- Designed for: Customized platforms addressing challenges in 3DIC and advanced packaging.
- Handling Capability: Standard silicon wafers, 3DIC (TSV, glass, stacks), and FO-WLP (mold compound, warped wafers).
- End-Effector Options: Dual end effectors and dual aligners capability for fast wafer swap.
- ID Readers: Front side and backside wafer ID readers.
- Environment: ISO Class 1 mini-environment.
- Standards: SEMI standards compliant.
- Load Ports: Available in 2 or 3 load ports.
- Compatibility: All SEMI compliant FOUP/MAC/FOSB types.