Dedication to Innovation
in R&D Programs
Pushing Limits to Discover ‘More Moore’, ‘More than Moore’ & ‘Beyond’
From 10 to sub-2nm
With a legacy of contributions to the industry’s advancements, RECIF is known as an innovative key player of the wafer handling solutions. The company was instrumental in developing several significant technologies during the early stages of 300mm line automation, such as FOUP door transfer system or Advanced Contact Technology. Building on its rich history of innovation, RECIF Technologies continues to design and manufacture its own full-turnkey solutions. Being an early adopter of SEMI Standards and automation technologies has set us in the path of ever evolving.
Through our collaborative ecosystem, we benefit from strong partnerships including imec and its pilot line, fostering a collaborative approach that supports European competitiveness and industry innovation. Through collaboration with major European companies, RECIF’s products are developed and evaluated on Europe’s most advanced pilot lines.
This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement n° 826422. The JU receives support from the European Union’s Horizon 2020 research and innovation program, as well as the Netherlands, Belgium, Germany, France, Romania, and Israel.
Our Commitment to Industry Innovation
RECIF participates in the CHIPS-JU projects and is a member of AENEAS and SEMI Europe.
Driven By Innovation
Our R&D Team has defined a roadmap built upon our long-term relationship with our customers and partners. The 450 initiative—where we led the project for 450mm wafer handling scale up with a brand new prototype—has led to further development on the SMART Platform. Still driven by market expectations, we made it evolve into 300mm sorter, 380mm wafer-on-frame sorter, and standardized 300mm EFEM. Our teams are continuously working on our products’ evolution and adaptation to meet our customers’ requirements. Thus, we remain focused on our objectives: to drive innovation and change in wafer handling, and to be an early adopter of standards.
