R.pack: The next step in efficiency & control
RECIF Technologies Introduces R.PACK: A Smarter Way to Manage Wafer Sorting
RECIF Technologies is excited to announce the launch of R.PACK as standard software for all RECIF tools.
With advanced capabilities and a refined interface, R.PACK simplifies the management of wafer sorting operations, making recipe creation and job monitoring more intuitive than ever.
What’s New with R.PACK?
Current users can switch to R.PACK with minimal disruption, thanks to its intuitive interface that simplifies adoption. A streamlined design improves navigation, ensuring smoother workflows and increased productivity.
Real-time tracking and context checkup, auto-logs and logs analysis… All you need to stay in control of your operations and optimize your process.
Starting January 2025, R.PACK will receive annual updates, introducing performance enhancements and new features to further optimize operations.
Built for Performance and Long-Term Efficiency
The release of R.PACK is part of RECIF Technologies’ continuous efforts to deliver high-performance solutions tailored to the semiconductor industry. By focusing on intuitive operation and improved efficiency, R.PACK represents just the beginning of a broader initiative to enhance user experience and system capabilities.
“We believe R.PACK will significantly improve our customers’ workflows and overall efficiency,” said Thomas Brillouet, R&D Manager at RECIF Technologies. “With its modern interface and enhanced features, we provide our customers with tools that increase safety, efficiency, and maximize their equipment’s potential with minimal effort.”
Your Wafer Handling Manager
R.PACK already includes Re.EASE, Re.ACT & Re.MAP.
Runs your operations smoothly with RE.EASE and its real-time tool view and convenient controls. Track and organize wafers like a music orchestrator, set the harmony between your tool and score with highly customizable interface and intuitive controls.
Your engineer needs to intervene for a quick tweak? Easily switch to RE.ACT and access the full range of parameters and handy auto-tunings. Adjust and optimize swiftly like a sound engineer.
Go into the past and review your jobs, logs, and effortlessly analyze them with RE.MAP. Acting as a smart logbook, it stores, organizes, and structures generated data into useful statistics and insights. More will come with the next updates and will include further agile and automated features, designed to keep pace with industry evolution and competitiveness requirements.
As software for semiconductor equipment, R.PACK complies with SEMI E95 Standard, defining software user interface basics, and SEMI E40, E84, E87, E90, E94 for connection with FAB Automation system. These high standards guarantee seamless integration into your FAB environment. Additionally, as a superior quality guarantee, R.PACK host communication has been tested with major SECS-II emulators such as Speech Scenario by Agileo Automation, and DiDaCT by Peer Group.
Availability and Future Updates
The first R.PACK update is now available, with subsequent updates scheduled annually every Q1. The software is compatible with RECIF sorters (COMPACT & SMART) and will fully replace the WISE software by 2027.
Stay tuned for more details on R.PACK, including system requirements and update schedules.
COMMITTED SUPPORT
Availability and Future Updates