RECIF Technologies HQ has moved to a new facility
Aussonne, France, 31/08/2026
After 20 years at our former site, RECIF Technologies is now operating from a new headquarters and manufacturing facility in the Toulouse-Blagnac airport area in Aussonne, less than 5km from where we were.
The new facility
The site doubles our total footprint:
- Advanced cleanroom space
- Expanded warehouse capacity
- Modern R&D lab
- Larger prototyping zone
Built for where the Semiconductor Industry is going
The substrate mix our customers work with has changed significantly over the past few years. Advanced packaging has brought glass, reconstituted wafers, wafer-on-frame, and large-format substrates into production environments that previously ran on silicon only. Supporting that range and doing it better, faster, takes more cleanroom capacity, R&D bandwidth, and a shorter prototyping loop. This new site gives us room to build all three properly.
A milestone 20 years in the making
Twenty years of projects, customers, and challenges brought us here. This move is the result of that work: carried out by a team that has grown alongside this company, and made possible by the trust our customers have placed in us year after year. We don’t take that lightly.
The new facility is our answer: more capacity, better conditions, faster response times, shorter development cycles and more room to tackle what comes next, alongside our customers.
We are looking forward to putting these new conditions to work for the projects already underway and everything coming down the line.
RECIF Technologies Team
