SEMICON West 2026

SEMICON West closed on Thursday, and glass handling was one of the subjects we heard about a lot at booth #5249.

Thank you to the customers and new contacts who came by and talked about their own substrates.

The questions kept coming back to three constraints. Seeing a transparent substrate: a clear wafer gives a detection system very little to work with. Holding it by the edge only: glass does not forgive a bad contact. Coping with warp: thin glass wafers can be warped, and the handling has to accept them as they are. That is what we learned on glass, and SMART also handles bonded wafers and mold compound.

If glass is on your roadmap, settle the handling requirements before the equipment is specified. Wafer thickness and expected warp are good places to start. Have a look at our product range, or reach out to talk through your substrates.