RECIF Technologies at SEMICON Taiwan 2026

Thanks to everyone who stopped by booth N0184 September 2–4th.

We enjoyed meeting our customers and connecting with newcomers, presenting our COMPACT sorter and SMART EFEM.

One thing came up in nearly every conversation: substrate diversity in the fab is no longer the exception, it’s the baseline. Glass, TAIKO, wafer-on-frame 380mm, even square wafers. Each format brings its own handling constraints.

That’s the assumption we design around: substrate handling shouldn’t be an afterthought. It should be part of the specifications from the start.

Have a look at our product range or reach out if you want to talk through your configuration.